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Multimold
Multi-functional In-Mold Electronics
MULTIMOLD advances film insert molding and in-mold decoration with integrated electronics to create complex 3D objects with seamless graphics and functional sensors.
It tackles current process challenges like low overmolding yields, high costs, and recyclability issues, while improving user experience with better sensor functionality and heat management.
The project aims to develop weather-resistant, recyclable materials combining electronics and advanced surfaces, serving industries from automotive to healthcare.
MULTIMOLD develops next-gen manufacturing for in-mold electronics with recyclable, weather-resistant materials. Products combine sensors, haptic feedback, and functional micro/nanostructured surfaces.
Key impacts:
- Inherent recyclability by design.
- Enhanced user experience in tough conditions.
- Improved manufacturing yield and cost efficiency.
Lead communication and dissemination
Manage exploitation and innovation
Assess worker skill gaps
Provide machine learning expertise
Project manager
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